🇵🇱 SIEĆ BADAWCZA ŁUKASIEWICZ - INSTYTUT PL

PCA AB 045 • Warszawa, Poland • 24 methods

Electronics & EMCEnvironmentAutomotive

SIEĆ BADAWCZA ŁUKASIEWICZ - INSTYTUT is a laboratory accredited by PCA under number AB 045 (Warszawa, Poland). Its accreditation scope covers 24 test methods in the following areas: Electronics & EMC, Environment, Automotive. Test objects include: Electronic and electrical products of low voltage, Vehicles (vehicl…, Electronic and electrical products of low voltage, Printed circuit boards, Electronic components, printed circuit boards, electronic assemblie….

At a glance

  • Accreditation number: PCA AB 045
  • Methods in scope: 24
  • Types of test objects: 13
  • City: Warszawa, Poland
Accreditation number
AB 045
Accreditation body
PCA
Address
TELE- I RADIOTECHNICZNY, LABORATORIUM BADANIA WYROBÓW ELEKTRONICZNYCH, ul. Ratuszowa 11
City
Warszawa, Poland

What this laboratory tests (13)

Accreditation scope — test methods (24)

No. Test object Methodology / Parameters Technique Reference document
Test methods
1 Electrical measuring instruments, automation and laboratory devices Features and properties for the purposes of assessing the safety of use PN-EN 61010-1:2011+ A1:2019-04* PN-EN 61010-2-010:2015-01 PN-EN IEC 61010-2-010:2020-10 * Wyłączenia dotyczą pkt. 11.6 | enia dotyczą: 11.6. Urządzenia specjalnie chronione 11.7. Ciśnienie płynu i przeciekanie 12. Ochrona przed promieniowaniem 13. Ochrona przed wydzielającymi się gazami | EN 61010-1:2010+A1:2019* EN 61010-2-010:2014 EN IEC 61010-2-010:2020 * Exclusions concern: 11.6. Special protected devices 11.7. Fluid pressure and leak 12. Protection against radiation 13. Protection against gas emissions
2 Information technology devices Machines and devices for organizational and technical office work resources Features and properties for the purposes of assessing the safety of use of electrical equipment PN-EN 62368-1:2015-03* + A11:2017-09 + Ap1:2018-03 + AC1:2016-01 + AC:2017 PN-EN IEC 62368-1:2020-11* + A11:2020-12+AC:2021-01 * Wyłączenia dotyczą rozdz.: 4.5 | EN 62368-1:2014* + A11:2017 + AC1:2015 + AC:2017-12* EN IEC 62368-1:2020/A11:2020* *Exclusions concern: p. 4.5
3 Electronic and electrical products of low voltage Immunity to electrostatic discharge Range: from 0,2 kV to 30 kV (contact and air discharges) PN-EN 61000-4-2:2011 EN 61000-4-2:2009
4 Vehicles (vehicle components) Immunity to electrostatic discharge Range: from 0.2 kV to 30 kV (contact and air discharges) ISO 10605:2008
5 Electronic and electrical products of low voltage Immunity to electrical fast transient/burst Range: from 0.2 kV to 5.5 kV PN-EN 61000-4-4:2013-05 EN 61000-4-4:2012
6 Electronic and electrical products of low voltage Immunity to electric shocks Range: from 0.16 kV to 5 kV PN-EN 61000-4-5:2014-10 PN-EN 61000-4-5:2014-10/A1:2018- 01 EN 61000-4-5:2014 EN 61000-4-5:2014/A1:2017
7 Electronic and electrical products of low voltage Immunity to conducted disturbances, induced by radio-frequency fields Range: from 0,15 MHz to 230 MHz PN-EN 61000-4-6: 2014-04 EN 61000-4-6: 2014
8 Electronic and electrical low voltage products (voltage max. 300 V, current max. 16 A) Immunity to dips, short breaks and voltage changes (power port AC) PN-EN 61000-4-11:2007+A1:2017-09 PN-EN IEC 61000-4-11:2020- 11+AC:2020-12 EN 61000-4-11:2004+A1:2016 EN IEC 61000-4-11:2020
9 Electronic and electrical products of low voltage, Vehicles (vehicle components) Environmental testing – Cold (test A to -65 C) PN-EN 60068-2-1:2009 EN 60068-2-1:2007 ISO 16750-4:2010 p. 5.1
10 Electronic and electrical products of low voltage, Vehicles (vehicle components) Environmental testing – Dry heat (test B to +160 C) PN-EN 60068-2-2:2009 EN 60068-2-2:2007 ISO 16750-4:2010 p. 5.1
11 Electronic and electrical products of low voltage, Vehicles (vehicle components) Environmental testing – Damp heat, steady state (test Cab) Range: (from 20 to 95) % RH PN-EN 60068-2-78:2013-11 EN 60068-2-78:2013 ISO 16750-4:2010 p. 5.7
12 Electronic and electrical products of low voltage, Vehicles (vehicle components) Environmental testing – Damp heat, cyclic (test Db) Range: (from 20 to 95) % RH PN-EN 60068-2-30:2008 EN 60068-2-30:2005 ISO 16750-4:2010 p. 5.6
13 Electronic and electrical products of low voltage, Vehicles (vehicle components) Environmental testing - Change of temperature (test Na, Nb), Range: (from -60 to +160) C - temperature step tests - Temperature cycling tests PN-EN 60068-2-14:2009+Ap1:2016- 07 z wył. pkt. 9 PN-EN IEC 60068-2-14:2024-04 z wył. pkt. 9 EN 60068-2-14:2009 excluding p. 9 PN-EN IEC 60068-2-14:2024-04 excluding p. 9 I SO 16750-4:2010 p. 5.2 ISO 16750-4:2010 p. 5.3
14 Electrical, telecommunication and electronic equipment, Whiskers Length: from 4 μm to 200μm Electron microscopy method (SEM) PN-EN 60068-2-82:2019-10 | EN 60068-2-82:2018
15 Electronic components, printed circuit boards, electronic assemblies (packages) The content of ionic impurities Range: (0.3 - 10) g NaCl / cm2 The method for measuring the resistance of a solution IPC-TM-650 2.3.25 Rev D, p. 6
16 Electronic components, printed circuit boards, electronic assemblies (packages) The content of Pb, Cd, Hg, Cr, Br Range: Pb: (392 - 1201) mg/kg Hg: (203 - 1157) mg/kg Cd: (90 - 337) mg/kg Cr: (337 - 968) mg/kg Br: (495 - 1110) mg/kg Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method IEC 62321 ed. 1.0
17 Electronic components for through- hole assembly Solderability -- Test Ta PN-EN 60068-2-54:2009 PN-EN 60068-2-69:2017-07+A1:2020- 01 EN 60068-2-54:2006 EN 60068-2-69:2017+A1:2019
18 Electronic components for surface mounting Solderability -- Test Te PN-EN 60068-2-69:2008 PN-EN 60068-2-69:2017-07+A1:2020- 01 EN 60068-2-69:2007 EN 60068-2-69:2017+A1:2019
19 Printed circuit boards Resistance to thermal shock and delamination PN-EN 61189-3:2008 p. 11.2 | EN 61189-3:2008 p. 11.2
20 Printed circuit boards Solderability of through holes and solder lands PN-EN 61189-3: 2008 p. 12.10 EN 61189-3: 2008 p. 12.10 JSTD-003B p. 4.2.2 i p. 4.2.7 JSTD-003C p. 4.2.1 i p 4.4.1 JSTD-003D p. 4.2.1 i p 4.4.
21 Printed circuit boards, soldered connections, electronic assemblies (packages) Internal structure of the metallographic sample – cross section IPC-TM-650 Rev E, p. 2.1.1 IPC-TM-650 Rev F, p. 2.1.1 IPC-A-600 Rev H, p. 3 IPC-A-600 Rev J, p. 3 IPC-A-600 Rev K, p.3 IPC-A-610 Rev E, p. 7.3.5.1 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J
22 Printed circuit boards, soldered connections, electronic assemblies (packages) Internal defects X-ray method Procedura A4 wydanie 1 z dnia 28.04.2020r. Procedure A4 issue 1 from 28.04.2020
23 Electronic assemblies The acceptability of electronics connections IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J
24 Printed circuit boards The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018

Reference standards (29)

EN 60068-2-82:2018
EN 61010-1:2010+A1:2019* EN 61010-2-010:2014 EN IEC 61010-2-010:2020 * Exclusions concern: 11.6. Special protected devices 11.7. Fluid pressure and leak 12. Protection against radiation 13. Protection against gas emissions
EN 61189-3:2008 p. 11.2
EN 62368-1:2014* + A11:2017 + AC1:2015 + AC:2017-12* EN IEC 62368-1:2020/A11:2020* *Exclusions concern: p. 4.5
IEC 62321 ed. 1.0
IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J
IPC-TM-650 2.3.25 Rev D, p. 6
IPC-TM-650 Rev E, p. 2.1.1 IPC-TM-650 Rev F, p. 2.1.1 IPC-A-600 Rev H, p. 3 IPC-A-600 Rev J, p. 3 IPC-A-600 Rev K, p.3 IPC-A-610 Rev E, p. 7.3.5.1 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J
ISO 10605:2008
PN-EN 60068-2-14:2009+Ap1:2016- 07 z wył. pkt. 9 PN-EN IEC 60068-2-14:2024-04 z wył. pkt. 9 EN 60068-2-14:2009 excluding p. 9 PN-EN IEC 60068-2-14:2024-04 excluding p. 9 I SO 16750-4:2010 p. 5.2 ISO 16750-4:2010 p. 5.3
PN-EN 60068-2-1:2009 EN 60068-2-1:2007 ISO 16750-4:2010 p. 5.1
PN-EN 60068-2-2:2009 EN 60068-2-2:2007 ISO 16750-4:2010 p. 5.1
PN-EN 60068-2-30:2008 EN 60068-2-30:2005 ISO 16750-4:2010 p. 5.6
PN-EN 60068-2-54:2009 PN-EN 60068-2-69:2017-07+A1:2020- 01 EN 60068-2-54:2006 EN 60068-2-69:2017+A1:2019
PN-EN 60068-2-69:2008 PN-EN 60068-2-69:2017-07+A1:2020- 01 EN 60068-2-69:2007 EN 60068-2-69:2017+A1:2019
PN-EN 60068-2-78:2013-11 EN 60068-2-78:2013 ISO 16750-4:2010 p. 5.7
PN-EN 60068-2-82:2019-10
PN-EN 61000-4-11:2007+A1:2017-09 PN-EN IEC 61000-4-11:2020- 11+AC:2020-12 EN 61000-4-11:2004+A1:2016 EN IEC 61000-4-11:2020
PN-EN 61000-4-2:2011 EN 61000-4-2:2009
PN-EN 61000-4-4:2013-05 EN 61000-4-4:2012
PN-EN 61000-4-5:2014-10 PN-EN 61000-4-5:2014-10/A1:2018- 01 EN 61000-4-5:2014 EN 61000-4-5:2014/A1:2017
PN-EN 61000-4-6: 2014-04 EN 61000-4-6: 2014
PN-EN 61010-1:2011+ A1:2019-04* PN-EN 61010-2-010:2015-01 PN-EN IEC 61010-2-010:2020-10 * Wyłączenia dotyczą pkt. 11.6
PN-EN 61189-3: 2008 p. 12.10 EN 61189-3: 2008 p. 12.10 JSTD-003B p. 4.2.2 i p. 4.2.7 JSTD-003C p. 4.2.1 i p 4.4.1 JSTD-003D p. 4.2.1 i p 4.4.
PN-EN 61189-3:2008 p. 11.2
PN-EN 62368-1:2015-03* + A11:2017-09 + Ap1:2018-03 + AC1:2016-01 + AC:2017 PN-EN IEC 62368-1:2020-11* + A11:2020-12+AC:2021-01 * Wyłączenia dotyczą rozdz.: 4.5
Procedura A4 wydanie 1 z dnia 28.04.2020r. Procedure A4 issue 1 from 28.04.2020
Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018
enia dotyczą: 11.6. Urządzenia specjalnie chronione 11.7. Ciśnienie płynu i przeciekanie 12. Ochrona przed promieniowaniem 13. Ochrona przed wydzielającymi się gazami