{"lab":{"_id":"69ad52a3de79e566650fb0e7","accr_number":"AB 045","country":"PL","accr_body":"PCA","address":"TELE- I RADIOTECHNICZNY, LABORATORIUM BADANIA WYROBÓW ELEKTRONICZNYCH, ul. 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to electrostatic discharge Range: from 0,2 kV to 30 kV (contact and air discharges) PN-EN 61000-4-2:2011 EN 61000-4-2:2009 Wyroby elektroniczne i elektryczne niskiego napiecia Electronic and electrical products of low voltage Odpornosc na wyladowania elektrostatyczne Zakres: od 0,2 kV do 30 kV (wyladowania kontaktowe i powietrzne) Immunity to electrostatic discharge Range: from 0,2 kV to 30 kV (contact and air discharges) PN-EN 61000-4-2:2011 EN 61000-4-2:2009","categories":["electronics"],"row_index":2,"parse_version":3,"parse_source":"m5-mistral-qa","search_en":"Electronic and electrical products of low voltage Immunity to electrostatic discharge Range: from 0,2 kV to 30 kV (contact and air discharges) PN-EN 61000-4-2:2011 EN 61000-4-2:2009","search_zh":"低压电子与电气制品 Electronic and electrical products of low voltage PN-EN 61000-4-2:2011 EN 61000-4-2:2009","test_object_zh":"低压电子与电气制品 Electronic and electrical products of low 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Procedure A4 issue 1 from 28.04.2020"},{"_id":"6a5a55e89af9f73f3824f471","lab_id":"69ad52a3de79e566650fb0e7","country":"PL","accr_number":"AB 045","accr_body":"PCA","test_object":"Zespoły elektroniczne Electronic assemblies","test_object_en":"Electronic assemblies","methodology":"Poprawność wykonania połączeń lutowanych The acceptability of electronics connections","methodology_en":"The acceptability of electronics connections","parameters":[],"parameters_en":[],"technique":null,"technique_en":null,"computed":[],"computed_en":[],"activity":"Poprawność wykonania połączeń lutowanych The acceptability of electronics connections","reference":"IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J","norm_bases":["IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J"],"lab_section":null,"lab_section_en":null,"lab_address":null,"regulatory_area":null,"regulatory_area_en":null,"search_text":"Zespoły elektroniczne Electronic assemblies Poprawność wykonania połączeń lutowanych The acceptability of electronics connections IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J Zespoly elektroniczne Electronic assemblies Poprawnosc wykonania polaczen lutowanych The acceptability of electronics connections IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J","categories":["electronics"],"row_index":22,"parse_version":3,"parse_source":"m5-mistral-qa","search_en":"Electronic assemblies The acceptability of electronics connections IPC-A-610 Rev E, p. 5, p. 7.3.5, p. 8.3 i p. 10.6 IPC-A-610 Rev F IPC-A-610 Rev G IPC-A-610 Rev GA IPC-A-610 Rev H IPC-A-610 Rev J"},{"_id":"6a5a55e89af9f73f3824f472","lab_id":"69ad52a3de79e566650fb0e7","country":"PL","accr_number":"AB 045","accr_body":"PCA","test_object":"Płytki obwodów drukowanych Printed circuit boards","test_object_en":"Printed circuit boards","methodology":"Grubość powłok Ni/Au na Cu oraz Sn na Cu Zakres: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 - 1.60) m - Cu: (3.78 - 34.00 ) m Metoda fluorescencyjnej spektrometrii rentgenowskiej z dyspersją energii (ED-XRF) The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method","methodology_en":"The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method","parameters":[],"parameters_en":[],"technique":null,"technique_en":null,"computed":[],"computed_en":[],"activity":"Grubość powłok Ni/Au na Cu oraz Sn na Cu Zakres: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 - 1.60) m - Cu: (3.78 - 34.00 ) m Metoda fluorescencyjnej spektrometrii rentgenowskiej z dyspersją energii (ED-XRF) The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method","reference":"Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018","norm_bases":["Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018"],"lab_section":null,"lab_section_en":null,"lab_address":null,"regulatory_area":null,"regulatory_area_en":null,"search_text":"Płytki obwodów drukowanych Printed circuit boards Grubość powłok Ni/Au na Cu oraz Sn na Cu Zakres: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 - 1.60) m - Cu: (3.78 - 34.00 ) m Metoda fluorescencyjnej spektrometrii rentgenowskiej z dyspersją energii (ED-XRF) The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018 Plytki obwodow drukowanych Printed circuit boards Grubosc powlok Ni/Au na Cu oraz Sn na Cu Zakres: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 - 1.60) m - Cu: (3.78 - 34.00 ) m Metoda fluorescencyjnej spektrometrii rentgenowskiej z dyspersja energii (ED-XRF) The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018","categories":["other"],"row_index":23,"parse_version":3,"parse_source":"m5-mistral-qa","search_en":"Printed circuit boards The thickness of Ni / Au coatings on Cu and Sn on Cu Range: - Au: (0.0031 - 0.048) m - Ni: (0.040 - 3.33) m - Sn: (0.46 -1.60) m - Cu: (3.78 - 34.00) m Energy dispersive X-ray fluorescence spectrometry (ED-XRF) method Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018","search_zh":"印制电路板 Printed circuit boards Procedura A5 wydanie 1 z dnia 27.04.2018 r. Procedure A5 issue 1 of 27.04.2018","test_object_zh":"印制电路板 Printed circuit boards"}],"has_pdf":true}