🇨🇿 G.L. Electronic s.r.o. PL
Electronics & EMCMaterials & polymers
G.L. Electronic s.r.o. is a laboratory accredited by ČIA under number 1774 (612 00 Brno - Královo Pole, Czech Republic). Its accreditation scope covers 5 test methods in the following areas: Electronics & EMC, Materials & polymers. Test objects include: Wires and crimped connections, Printed circuit boards (PCBs), Soldered electronic components.
At a glance
- Accreditation number: ČIA 1774
- Methods in scope: 5
- Types of test objects: 3
- City: 612 00 Brno - Královo Pole, Czech Republic
- Valid until: 14-08-2030
- Accreditation number
- 1774
- Accreditation body
- ČIA
- Address
- Podnikatelská 2902/4, 612 00 Brno - Královo Pole
- City
- 612 00 Brno - Královo Pole, Czech Republic
- Division
- Laboratorium Badawcze G.L. Electronic
- Valid until
- 14-08-2030
What this laboratory tests (3)
- Wires and crimped connections — 3 methods
- Printed circuit boards (PCBs) — 1 method
- Soldered electronic components — 1 method
Laboratory sections (3)
- Metallography Facility — 3 methods
- Electronic Testing Facility — 1 method
- Mechanical Testing Facility — 1 method
Laboratory locations
- Pracownia metalografii — Podnikatelská 2902/4
- Pracownia badań mechanicznych — Podnikatelská 2902/4
- Pracownia badań elektronicznych — Podnikatelská 2902/4
Certificate information
- Certificate date
- 14.08.2025
Accreditation scope — test methods (5)
| No. | Test object | Methodology / Parameters | Technique | Reference document | |
|---|---|---|---|---|---|
| Metallography Facility | |||||
| 1 | Wires and crimped connections | Metallographic test | MMP-01-GLE (ECSS-Q-ST-70-26C Rev.1:3/2017 + Corrigendum 1:6/2017) | ||
| 2 | Soldered electronic components | Metallographic test | MMP-01-GLE (ECSS-Q-ST-70-61C:4/2022) | ||
| 3 | Printed circuit boards (PCBs) | Metallographic test | MMP-01-GLE (ECSS-Q-ST-70-60C Rev.1:4/2025) | ||
| Mechanical Testing Facility | |||||
| 4 | Wires and crimped connections | Test of tensile strength | TSTP-01-GLE (ECSS-Q-ST-70-26C Rev.1:3/2017 + Corrigendum 1:6/2017) | ||
| Electronic Testing Facility | |||||
| 5 | Wires and crimped connections | Four-wire voltage drop measurement | VDTP-01-GLE (ECSS-Q-ST-70-26C:7/2008)) | ||
Reference standards (7)
ECSS-Q-ST-70-26C Rev.1:3/2017 + Corrigendum 1:6/2017
ECSS-Q-ST-70-26C:7/2008
ECSS-Q-ST-70-60C Rev.1:4/2025
ECSS-Q-ST-70-61C:4/2022
MMP-01-GLE
TSTP-01-GLE
VDTP-01-GLE